ZutaCore's HyperCool Direct-on-Chip cooling uses patented two-phase waterless liquid cooling to remove heat right at the processor, enabling higher compute density and energy-efficient performance in demanding HPC, AI, and data center environments
Cooling solutions for high performance computing environments
ZutaCore’s approach dramatically reduces cooling energy and operational costs while increasing reliability. By eliminating water and moving heat directly from chips into a sealed loop, HyperCool supports extreme power densities and helps data centers scale without throttling, expand compute capacity, and advance sustainability goals.
Key features
- Cool processors greater than 1,000W and heat-flux greater than 90 W/cm2
- Improve energy efficiency with partial PUE as low as a constant 1.02
- Eliminate hot spots in racks and the data center
- Easy retrofit for incremental improvement to existing data centers
- Fast and easy retrofits for servers, in less than four minutes
- Complete HyperCool solution for new data centers
- Enable the design of new, higher density processors, servers and racks
- Cool increasingly dense CPUs, racks and data centers
- Make high performance computing possible in environments with limited air, infrastructure and serviceability
- Accelerate ubiquity of IoT, 5G, AI, edge, autonomous vehicles
Expert guidance
Speak with our specialists to learn how ZutaCore’s Direct-on-Chip cooling solutions can support your performance, density, and efficiency goals. Contact thomas@nextron.no for tailored guidance, or visit zutacore.com for additional technical insights.